TSMC Digs Trenches In Search Of Higher Performance – WikiChip Fuse - discu.eu

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TSMC leverages existing silicon in the CoWoS process to improve the power delivery system of high-performance applications through new, deep trench capacitors, codename iCAPs. https://fuse.wikichip.org/news/3144/tsmc-digs-trenches-in-search-of-higher-performance/ 4 comments 14/12/2019 hardware

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Chip-on-Wafer-on-Substrate (CoWoS) - TSMC - WikiChip https://en.wikichip.org/wiki/tsmc/cowos 0 comments

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