- TSMC leverages existing silicon in the CoWoS process to improve the power delivery system of high-performance applications through new, deep trench capacitors, codename iCAPs. https://fuse.wikichip.org/news/3144/tsmc-digs-trenches-in-search-of-higher-performance/ 4 comments hardware
Linked pages
Related searches:
Search whole site: site:fuse.wikichip.org
Search title: TSMC Digs Trenches In Search Of Higher Performance – WikiChip Fuse
See how to search.