• TSMC N3E: The Power Behind Apple's M4 SoC – TechInsights https://www.techinsights.com/blog/introducing-tsmc-n3e-power-behind-apples-m4-soc 2 comments 17/6/2024
• SMIC reaches 7nm without access to western equipment and technologies https://www.techinsights.com/blog/smic-7nm-truly-7nm-technology-how-it-compares-tsmc-7nm 114 comments 29/8/2022
• Analysis of Apple M1 Is Happening – and, Thermal Imaging? https://www.techinsights.com/blog/analysis-apple-m1-happening-and-thermal-imaging 3 comments 27/12/2020
• Apple Silicon M1 Die-Shots https://www.techinsights.com/blog/two-new-apple-socs-two-market-events-apple-a14-and-m1 107 comments 26/12/2020

• TechInsights: Samsung SF3 (2nd Gen 3nm GAA) in Exynos W1000 Processor Confirmed https://www.techinsights.com/blog/samsung-sf3-2nd-gen-3nm-gaa-exynos-w1000-processor-confirmed 4 comments 20/11/2024 hardware
• Introducing TSMC N3E: The Power Behind Apple's M4 SoC https://www.techinsights.com/blog/introducing-tsmc-n3e-power-behind-apples-m4-soc 97 comments 16/6/2024 hardware
• Techinsights: China Does It Again: A NAND Memory Market First (YMTC NAND contained QLC die with highest bit density seen in commercially available NAND product) https://www.techinsights.com/blog/china-does-it-again-nand-memory-market-first 76 comments 25/10/2023 hardware
• "TechInsights Finds SMIC 7nm (N+2) in Huawei Mate 60 Pro" https://www.techinsights.com/blog/techinsights-finds-smic-7nm-n2-huawei-mate-60-pro 141 comments 10/9/2023 hardware
• TechInsights: "SMIC 7nm N+2 in Huawei Mate 60 Pro: Uncovering the innovation inside the chip" https://www.techinsights.com/blog/smic-7nm-n2-huawei-mate-60-pro-uncovering-innovation-inside-chip 43 comments 8/9/2023 hardware
• SMIC 7nm (N+2) in Huawei Mate 60 Pro https://www.techinsights.com/blog/techinsights-finds-smic-7nm-n2-huawei-mate-60-pro 6 comments 6/9/2023 hardware
• Is Arm shooting itself in the foot with suing Qualcomm over nuvia ip? - discussion https://www.techinsights.com/blog/editorial-arms-no-win-legal-fight 189 comments 6/1/2023 android
• YMTC’s Xtacking 3.0, first to 200+ layers. This Chinese company is now the leader in 3D NAND Flash https://www.techinsights.com/disruptive-event/ymtc-232l-tlc-3d-nand 2 comments 30/11/2022 technology
• YMTC’s Xtacking 3.0, first to 200+ layers. This Chinese company is now the leader in 3D NAND Flash https://www.techinsights.com/disruptive-event/ymtc-232l-tlc-3d-nand 26 comments 30/11/2022 hardware
• "Qualcomm dual-sourced Snapdragon 8(+) Gen1 SOC: TechInsights' confirms TSMC N4 is a true optical shrink from N5 node" https://www.techinsights.com/blog/qualcomm-snapdragon-8-gen1-soc 15 comments 11/10/2022 hardware
• TechInsights: "MediaTek Delivers Efficient Cortex-X2" https://www.techinsights.com/blog/mediatek-delivers-efficient-cortex-x2 8 comments 2/8/2022 hardware
• TechInsights: "Editorial: Nanometer Nonsense" https://www.techinsights.com/blog/editorial-nanometer-nonsense 7 comments 26/7/2022 hardware
• SMIC 7nm technology found in MinerVa Bitcoin Miner | TechInsights https://www.techinsights.com/blog/disruptive-technology-7nm-smic-minerva-bitcoin-miner 54 comments 20/7/2022 hardware
• TechInsights: "An examination of the 5G radio in Google Pixel 6 Pro" https://www.techinsights.com/blog/teardown/examination-5g-radio-google-pixel-6-pro 10 comments 7/12/2021 hardware
• Google Pixel 6 Pro Teardown https://www.techinsights.com/blog/teardown/google-pixel-6-pro-teardown 7 comments 2/11/2021 android
• TechInsights: "Apple iPhone 13 Pro Teardown" https://www.techinsights.com/blog/teardown/apple-iphone-13-pro-teardown 5 comments 1/10/2021 hardware
• [TechInsights] Samsung Galaxy S20 Ultra 5G Teardown Analysis https://www.techinsights.com/blog/samsung-galaxy-s20-teardown-analysis 13 comments 5/3/2020 hardware
• The A13 Bionic die size is 10.67mm x 9.23mm = 98.48 mm2, representing a 18.27% die size increase when compared to the previous A12 https://www.techinsights.com/blog/apple-iphone-11-pro-max-teardown 33 comments 26/9/2019 hardware
• TechInsights: Apple iPhone 11 Pro Max Teardown (in progress) https://www.techinsights.com/blog/apple-iphone-11-pro-max-teardown 19 comments 24/9/2019 hardware
• TechInsights memory technology update from IEDM18 https://www.techinsights.com/blog/techinsights-memory-technology-update-iedm18 5 comments 17/4/2019 hardware
• TechInsights: Samsung Galaxy S10+ Teardown https://www.techinsights.com/about-techinsights/overview/blog/samsung-galaxy-s10plus/ 5 comments 9/3/2019 hardware
• Apple iPhone XS and XS Max maybe support 802.11ax (Wi-Fi 6) http://www.techinsights.com/about-techinsights/overview/blog/apple-iphone-xs-teardown/#wifibt 10 comments 9/10/2018 hardware
• Apple's A12 die shot analysed and how a potential Apple A12X SoC could look like. http://www.techinsights.com/ 36 comments 25/9/2018 hardware
• TSMC's 7nm FinFET process used by Apple's A12 Bionic SoC features 67,4% more transistors per mm2 than 10nm and 211,3% more than 16nm http://www.techinsights.com/about-techinsights/overview/blog/apple-iphone-xs-teardown/ 134 comments 23/9/2018 hardware
• Iphone Xs teardown reveals micron chips in both North American and Australian units. http://www.techinsights.com/about-techinsights/overview/blog/apple-iphone-xs-teardown/ 49 comments 23/9/2018 wallstreetbets
• Intel 10 nm Logic Process Overview from Techinsights - 6.2T and Ru(thenium) http://www.techinsights.com/technology-intelligence/overview/latest-reports/intel-10-nm-logic-process/ 35 comments 13/6/2018 intel
• Intel 10 nm Logic Process Overview from Techinsights - 6.2T and Ru(thenium) http://www.techinsights.com/technology-intelligence/overview/latest-reports/intel-10-nm-logic-process/ 22 comments 13/6/2018 hardware
• Apple iPhone 8 Plus Teardown http://www.techinsights.com/about-techinsights/overview/blog/apple-iphone-8-teardown/ 2 comments 22/9/2017 hardware
• Galaxy S8 in-depth teardown http://www.techinsights.com/about-techinsights/overview/blog/samsung-galaxy-s8-teardown/ 7 comments 7/5/2017 hardware