- Intel has championed High-NA EUV chipmaking tools, but costs and other limitations could delay industry-wide adoption https://www.tomshardware.com/tech-industry/intel-has-championed-high-na-euv-chipmaking-tools-but-costs-and-other-limitations-could-delay-industry-wide-adoption-report 14 comments hardware
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- TSMC won't adopt advanced High-NA EUV chipmaking tools until 2030 or later — Intel just received its first tool this week: Report | Tom's Hardware https://www.tomshardware.com/tech-industry/manufacturing/tsmc-to-adopt-high-na-euv-tools-in-2030-or-later-report 115 comments
- Intel shares biggest unboxing video ever as ASML’s $380 million High-NA lithography machine is installed in Oregon fab | Tom's Hardware https://www.tomshardware.com/tech-industry/semiconductors/intel-shares-biggest-unboxing-video-ever-as-asmls-dollar380-million-high-na-lithography-machine-is-installed-in-oregon-fab 36 comments
- Russia completes development of 30-year-old outdated lithography tool | Tom's Hardware https://www.tomshardware.com/tech-industry/russia-completes-development-of-30-year-old-outdated-lithography-tool 33 comments
- TSMC to build 30% of its 2nm and more advanced chips in the U.S., to speed up Fab 21 build out | Tom's Hardware https://www.tomshardware.com/tech-industry/tsmc-to-build-30-percent-of-its-2nm-and-more-advanced-chips-in-the-u-s-to-speed-up-fab-21-build-out 32 comments
- AMD patents configurable multi-chiplet GPU — illustration shows three dies | Tom's Hardware https://www.tomshardware.com/pc-components/gpus/amd-patents-configurable-multi-chiplet-gpu-illustration-shows-three-dies 31 comments
- Chinese brain computer interface user reportedly plays 'Black Myth: Wukong,' other games | Tom's Hardware https://www.tomshardware.com/peripherals/controllers-gamepads/chinese-brain-computer-interface-user-reportedly-plays-black-myth-wukong-other-games 14 comments
- Intel's 18A and TSMC's N2 process nodes compared: Intel is faster, but TSMC is denser | Tom's Hardware https://www.tomshardware.com/tech-industry/intels-18a-and-tsmcs-n2-process-nodes-compared-intel-is-faster-but-tsmc-is-denser 13 comments
- Intel has processed 30,000 wafers with High-NA EUV chipmaking tool | Tom's Hardware https://www.tomshardware.com/tech-industry/intel-has-processed-30-000-wafers-with-high-na-euv-chipmaking-tool 3 comments
- ASML teams up with Imec for sub-2nm process technologies with High-NA EUV chipmaking tools | Tom's Hardware https://www.tomshardware.com/tech-industry/asml-teams-up-with-imec-for-sub-2nm-process-technologies-with-high-na-euv-chipmaking-tools 0 comments
- High-NA is Here (for R&D), EUV Cost, Pattern Shaping Gaining Share, 6×12″ Mask, Metal Oxide & Dry Resist, Hyper-NA – SemiAnalysis https://semianalysis.com/2025/04/14/spie2025/ 0 comments