- Imec Reveals Sub-1nm Transistor Roadmap, 3D-Stacked CMOS 2.0 Plans https://www.tomshardware.com/news/imec-reveals-sub-1nm-transistor-roadmap-3d-stacked-cmos-20-plans 5 comments hardware
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- China's Powerstar CPU Seemingly 'Confirmed' as Intel Silicon via Geekbench | Tom's Hardware https://www.tomshardware.com/news/chinas-powerstar-cpu-seemingly-confirmed-as-intel-silicon-via-geekbench 39 comments
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- Tom's Hardware: For The Hardcore PC Enthusiast https://www.tomshardware.com/ 381 comments
- TSMC's 3nm Node: No SRAM Scaling Implies More Expensive CPUs and GPUs | Tom's Hardware https://www.tomshardware.com/news/no-sram-scaling-implies-on-more-expensive-cpus-and-gpus 115 comments
- Intel to Show Off E-Core-Based CPU with Backside Power Delivery | Tom's Hardware https://www.tomshardware.com/news/intel-to-show-ff-e-core-based-cpu-with-backside-pdn 101 comments
- China's Powerstar CPU Seemingly 'Confirmed' as Intel Silicon via Geekbench | Tom's Hardware https://www.tomshardware.com/news/chinas-powerstar-cpu-seemingly-confirmed-as-intel-silicon-via-geekbench 39 comments
- All Microsoft Surface Pro X Cameras Stopped Working Tuesday | Tom's Hardware https://www.tomshardware.com/news/all-microsoft-surface-pro-x-cameras-stopped-working-tuesday 36 comments
- Acer’s Swift Edge 16 Uses Ryzen 7040, Supports Wi-Fi 7 (Updated) | Tom's Hardware https://www.tomshardware.com/news/acer-swift-edge-16-wi-fi-7-predator-triton-16-price-specs-release-date 10 comments
- Imec Presents Sub-1nm Process and Transistor Roadmap Until 2036: From Nanometers to the Angstrom Era | Tom's Hardware https://www.tomshardware.com/news/imecs-sub-1nm-process-node-and-transistor-roadmap-until-2036-from-nanometers-to-the-angstrom-era 6 comments
- CFET (complementary FET) on the logic technology roadmap | imec https://www.imec-int.com/en/articles/imec-puts-complementary-fet-cfet-logic-technology-roadmap 1 comment
- AMD Unveils More Ryzen 3D Packaging and V-Cache Details at Hot Chips | Tom's Hardware https://www.tomshardware.com/news/amd-unveils-more-ryzen-3d-packaging-and-v-cache-details-at-hot-chips 0 comments
- Samsung to Detail Second-Gen 3nm Node, But Admits It Is Behind TSMC | Tom's Hardware https://www.tomshardware.com/news/samsung-to-detail-next-generation-3nm-node 0 comments
- 3D-Printed Bare-Die Liquid Chip Coolers Smash Barriers, up to 3.5X Improvement | Tom's Hardware https://www.tomshardware.com/news/3d-printed-bare-die-liquid-coolers 0 comments
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