Intel demos first Lakefield chip design using 3D stacking architecture - The Verge - discu.eu

Reddit

Intel demos first Lakefield chip design using 3D stacking architecture https://www.theverge.com/2019/1/7/18173001/intel-lakefield-foveros-3d-chip-stacking-soc-design-ces-2019 3 comments 8/1/2019 technology

Linked pages

The Verge https://www.theverge.com/ 326 comments
Intel Lakefield Brings Its 3D Chip-Stacking Tech to Life | WIRED https://www.wired.com/story/intel-lakefield/ 0 comments

Related searches:

Search whole site: site:www.theverge.com

Search title: Intel demos first Lakefield chip design using 3D stacking architecture - The Verge

See how to search.

Submit link to: