- [Toms Hardware] TSMC and Arm Show First 7nm Interposer-Based Chiplet System for HPC https://www.tomshardware.com/news/tsmc-arm-7nm-interposer-chiplet-cowos-lipincon,40498.html 7 comments hardware
Linking pages
- TSMC's New CoWoS Tech Doubles Memory Bandwidth | Tom's Hardware https://www.tomshardware.com/news/tsmcs-new-cowos-tech-doubles-memory-bandwidth 0 comments
- European ExaNoDe Combines Chiplets, FPGAs, HBM, Active Interposers in 3DIC | Tom's Hardware https://www.tomshardware.com/news/european-exanode-combines-chiplets-fpgas-hbm-active-interposers-in-3dic 0 comments
Linked pages
- Tom's Hardware: For The Hardcore PC Enthusiast https://www.tomshardware.com/ 381 comments
- Intel Reveals Three new Cutting-Edge Packaging Technologies | Tom's Hardware https://www.tomshardware.com/news/intel-packaging-co-emib-odi-foveros-mdio,39840.html 115 comments
- Intel Deep Dives on Nervana NNP-T: 27 Billion Transistors, 32GB of HBM2 Packed on 688mm-Squared Die | Tom's Hardware https://www.tomshardware.com/news/intel-nervana-nueral-net-processor-nnt-p,40185.html 48 comments
- TSMC Demonstrates A 7nm Arm-Based Chiplet Design for HPC – WikiChip Fuse https://fuse.wikichip.org/news/2446/tsmc-demonstrates-a-7nm-arm-based-chiplet-design-for-hpc/ 46 comments
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