Linking pages
- How Nvidia’s CUDA Monopoly In Machine Learning Is Breaking - OpenAI Triton And PyTorch 2.0 https://www.semianalysis.com/p/nvidiaopenaitritonpytorch 112 comments
- Apple’s AI Strategy: Apple Datacenters, On-device, Cloud, And More https://www.semianalysis.com/p/apples-ai-strategy-apple-datacenters 56 comments
- CXL Is Dead In The AI Era https://www.semianalysis.com/p/cxl-is-dead-in-the-ai-era 39 comments
- TSMC’s 3nm Conundrum, Does It Even Make Sense? – N3 & N3E Process Technology & Cost Detailed https://www.semianalysis.com/p/tsmcs-3nm-conundrum-does-it-even 34 comments
- Ventana RISC-V CPUs Beating Next Generation Intel Sapphire Rapids! – Overview of 13 RISC-V Companies, CPUs, and Ecosystem https://www.semianalysis.com/p/ventana-risc-v-cpus-beating-next 26 comments
- Intel GenAI For Yield, TSMC CFET & 3D Stacking, AMD 3D Device Modeling, Applied Materials Material Innovation, SK Hynix HBM 4, Micron 3D DRAM & FeRAM, Hybrid Bonding vs TCB - IEDM 2023 https://www.semianalysis.com/p/intel-genai-for-yield-tsmc-cfet-and 17 comments
- Marvell's Vision – Custom Silicon, CXL, DPUs, Ethernet, Optical, Telecom, Storage, Automotive, SerDes, 2025 Revenue & EPS https://www.semianalysis.com/p/marvelldeepdive2022 2 comments
- AMD MI300 – Taming The Hype – AI Performance, Volume Ramp, Customers, Cost, IO, Networking, Software https://www.semianalysis.com/p/amd-mi300-taming-the-hype-ai-performance 2 comments
- Tesla AI Capacity Expansion – H100, Dojo D1, D2, HW 4.0, X.AI, Cloud Service Provider https://www.semianalysis.com/p/tesla-ai-capacity-expansion-h100 2 comments
- Separating Reality from Hype - Quantum Computing Explained https://www.semianalysis.com/p/separating-reality-from-hype-quantum 0 comments
- AI Capacity Constraints - CoWoS and HBM Supply Chain https://www.semianalysis.com/p/ai-capacity-constraints-cowos-and 0 comments
- Energizing AI: Power Delivery Competition Heats Up Vicor, MPS, Delta, ADI https://www.semianalysis.com/p/energizing-ai-power-delivery-competition 0 comments
- Hybrid Bonding Process Flow - Advanced Packaging Part 5 https://www.semianalysis.com/p/hybrid-bonding-process-flow-advanced 0 comments
Linked pages
- Amazon Graviton 3 Uses Chiplets & Advanced Packaging To Commoditize High Performance CPUs | The First PCIe 5.0 And DDR5 Server CPU https://semianalysis.substack.com/p/amazon-graviton-3-uses-chiplets-and 30 comments
- Intel’s Trojan Horse into the Foundry Business | Co-packaged Silicon Photonics is Intel’s Path Forward for IDM 2.0 https://semianalysis.substack.com/p/intels-trojan-horse-into-the-foundry 16 comments
- Morgan Stanley Just Reduced TSMC’s Value By $25B While Demonstrating A Complete Lack of Semiconductor Knowledge https://semianalysis.substack.com/p/morgan-stanley-just-reduced-tsmcs 2 comments
- Tesla Dojo, Unique Packaging and Chip Design Allow An Order Magnitude Advantage Over Competing AI Hardware https://semianalysis.substack.com/p/tesla-dojo-unique-packaging-and-chip 0 comments